CONNECTION STRUCTURE, POWER MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a compact bonded structure with high reliability, while preventing deterioration in conductivity and heat dissipation.

SOLUTION: In ultrasonic bonding of a metal terminal 120 to a substrate pad 113, a thin buffer metal layer 140 which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal 120 and the pad 113 upon bonding. This prevents abrasion and a crack in the pad 113 caused by pressure and an ultrasonic wave upon the ultrasonic bonding through the end of the terminal 120.

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