SOLID-STATE IMAGE PICKUP DEVICE AND A METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A solid-state image pickup device and a method of manufacturing the same are provided to simplify a manufacturing process by forming an align mark and the configuration of a contact unit as same type. CONSTITUTION: A pixel(20) and an isolation area(12) are formed on a silicon layer. A pixel converts an incident light into a signal. The isolation area divides a peripheral circuit portion(30) for processing a signal charge from the pixel. The alignment mark(50) and contact unit(61) are formed on the pixel. A first electrode(44) is formed on the first surface of the silicon layer. A second electrode(66) is formed on a second side opposite to the first surface of the silicon.