| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition that is best suited for use as an interlaminar insulating film in a semiconductor element device or the like, rarely causes film decrease at film hardening, and produces a film excellent in such characteristics as a dielectric constant, and to provide a film obtained using the composition. Ž<P>SOLUTION: The composition uses aromatic hydrocarbon as a principal component wherein all the hydrogen atoms in molecules combine with carbon atoms that constitute the aromatic hydrocarbon, a 5% weight reduction temperature shows 250 to 450°C in thermogravimetric analysis (at a temperature increase rate of 20°C/min under vacuum of 1 mmHg), and the composition includes a chemical compound acting as a hole forming agent (P) and a resin or a resin precursor. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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