| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of more effectively preventing a substrate passing through an opening from being contaminated. Ž<P>SOLUTION: A shutter mechanism 19 includes a first shutter 20 capable of covering the opening 17, a second shutter 21 capable of covering an upper region 2 AU of a side wall 2A above the opening 17, and a first moving mechanism 30 configured to elevated and lower the first shutter 20 and second shutter 21. The first moving mechanism 30 elevates and lowers the first shutter 20 and second shutter 21 while maintaining a perpendicular posture between in a closing state in which the first shutter 20 closes the opening 17 and the second shutter 21 covers the majority of an upper region 2 AU and in an opening state in which the first shutter 20 and second shutter 21 retract below a path line PL. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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