PHOTOSENSITIVE RESIN COMPOSITION FOR LASER ENGRAVABLE PRINTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for a laser engravable substrate which facilitates the removal of sticky debris produced in surface treatment process. SOLUTION: The photosensitive resin composition for a laser engravable printing substrate contains: a resin (a) having a polymerizable unsaturated group of a number-average molecular weight in the range of 1,000 to 200,000; an organic compound (b) having a polymerizable unsaturated group of a number-average molecular weight less than 1,000; and an organosilicon compound (c) which has at least one Si-O bond in a molecule and has no polymerizable unsaturated group in the molecule, wherein the content of the organosilicon compound (c) is in the range of 0.1 wt.% to 10 wt.% with respect to the whole of the photosensitive resin composition. COPYRIGHT: (C)2010,JPO&INPIT