ROD UNIT FOR EXTRACTING A THIN CHIP AND A EXTRACTING METHOD FOR A THIN CHIP USING THE SAME

摘要

PURPOSE: A load unit extracting a thin film chip and a method for extracting a thin film chip using the same are provided to simplify a mechanical structure by using the load units with different sizes. CONSTITUTION: A plurality of thin film chips are separately arranged on a wafer. An individual thin film chip(302) is separated from other thin film chips by applying the pressure to a load unit by lifting the load unit from the lower side of the wafer. The separated thin film is extracted by a pickup unit and is transferred.