| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface inspecting device capable of shortening an inspection time, while suppressing the lowering of detection sensitivity and increase in thermal damages at surface inspection, and to provide a surface inspecting method which uses the device. SOLUTION: The surface inspecting device is constituted such that an object to be inspected is rotatively moved, to be set as the main scanning and is moved translationally, to be set as the subscanning; the surface of a semiconductor wafer 100 is irradiated with an illumination light 21 to form the illumination spot 3 which is the irradiation range of the illumination light 21; and the scattered light, diffracted light and reflected light from the illumination spot are detected and the foreign matter present on or in the vicinity of the surface of the semiconductor wafer 100 is detected, on the basis of the detection results. In this surface inspecting device, the translationally moving speed of the subscanning is controlled according to the distance up to the illumination spot from the center of rotation in the main scanning of the semiconductor wafer 100. COPYRIGHT: (C)2010,JPO&INPIT
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