| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrateless adhesive sheet for semiconductor wafer protection, causing no curvature (warpage) on a semiconductor wafer even when the semiconductor wafer is ground to an extremely thin thickness or a large diameter wafer is ground, having excellent stress diffusibility during grinding and high thickness precision, and suppressing wafer cracking or wafer edge chipping, and also to provide a semiconductor wafer backside grinding method using the adhesive sheet, and a production method of the adhesive sheet. SOLUTION: This substrateless adhesive sheet for semiconductor wafer protection is a substrateless adhesive sheet for semiconductor wafer protection which is composed only of an adhesive layer for lamination on the surface of a semiconductor wafer when the backside of the semiconductor wafer is ground. The adhesive layer is a ultraviolet ray curable adhesive comprising a polymer containing an acrylic monomer polymerizable compound as a main material, an adhesive force of the surface of the adhesive sheet to be laminated to the surface of the semiconductor wafer is larger than that of the opposite surface of the adhesive sheet, and the initial elastic modulus is 0.01-500 MPa. COPYRIGHT: (C)2010,JPO&INPIT |
