发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To effectively carry out a memory test at a low cost for a semiconductor device, including a semiconductor memory. SOLUTION: In a test burn-in apparatus, twenty-four test boards are sequentially processed while keeping a time difference, and each test board is circulated one by one. In the above case, the memory test is carried out through a sheetfed processing sequence, in which the test is started from a test board which finishes mounting a semiconductor device, and a semiconductor device is removed from a test board whose test is finished. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010210645(A) 申请公布日期 2010.09.24
申请号 JP20100142643 申请日期 2010.06.23
申请人 RENESAS ELECTRONICS CORP 发明人 WADA YUJI;KIYOFUJI AKIRA;NANBA MASAAKI
分类号 G01R31/26 主分类号 G01R31/26
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