发明名称 LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
摘要 A light emitting diode (LED) package is provided. According to an embodiment, a light emitting apparatus includes a substrate; at least two distinct electrodes on the substrate; a light emitting device on one of the at least two distinct electrodes, wherein the at least two distinct electrodes are electrically separated from each other and spaced from each other; a guide unit on the substrate and around the light emitting device, wherein the guide unit includes an inner side surface, an outer side surface, a top surface and a bottom surface; and lenses including a first lens and a second lens on the substrate, wherein at least one of the lenses includes a convex shape and a portion of the at least one of the lenses is located higher than the top surface of the guide unit.
申请公布号 US2010237377(A1) 申请公布日期 2010.09.23
申请号 US20100794440 申请日期 2010.06.04
申请人 PARK BO GEUN 发明人 PARK BO GEUN
分类号 H01L33/54;H01L33/58;H01L33/40;H01L33/56;H01L33/62 主分类号 H01L33/54
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