| 摘要 |
Semiconductor sensor chips are assembled with semiconductor communication chips to form sensor nodes which are wired together and placed in a tube preform which is sealed to form a tube containing an array of sensor nodes. The tube, resembling a wire in appearance, can then be assembled with power conductors to form a power delivery cable to allow monitoring of conditions within the cable at a plurality of spaced locations along the length of the cable. By monitoring conditions at spaced locations within the cable during use, the cable can be operated near or at its actual current carrying capacity which may be altered by ambient conditions such as the shape of the cable, strain applied thereto, damage, or whether the cable is partially wound on a spool or reel that prevents dissipation of heat due to ohmic losses in the cable; thus allowing management of risk of failure of the cable without a requirement for additional, generally unused current carrying capacity in the design of the cable.
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