发明名称 Method for controlling plasma density distribution in vacuum process for treating substrate, arranging multiple anodes adjacent to cathode in vacuum chamber, such that plasma area is defined
摘要 <p>The method arranging multiple anodes (11,11',21,21') adjacent to a cathode (4) in a vacuum chamber, such that a plasma area is defined. The plasma discharge is generated in the plasma area. The power supply (7) of the individual anodes is controlled, such that the anode current (10) of the anode of a series of adjacent anodes has a current value between a maximum current value and zero, and the anode current of another anode of the series has a different current value. An independent claim is also included for a device for controlling a plasma density distribution in a vacuum process for treating a substrate.</p>
申请公布号 DE102009017888(A1) 申请公布日期 2010.09.23
申请号 DE20091017888 申请日期 2009.03.20
申请人 VON ARDENNE ANLAGENTECHNIK GMBH 发明人 TEICHERT, BERND
分类号 H05H1/46;H05H1/02;H05H1/36 主分类号 H05H1/46
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