ORGANIC ELECTRONIC PANEL AND METHOD FOR MANUFACTURING ORGANIC ELECTRONIC PANEL

摘要

Provided is an organic electronic panel wherein warping (deformation) of a metal member is suppressed when the metal member is used as a packaging board, an electrical short-circuit due to the warping is eliminated, and generation of light emission failure and deterioration of power generating performance are eliminated. In the organic electronic panel, the packaging board is composed of a metal foil, and a polymer film is laminated on the metal foil surface on the reverse side of the side having the adhesive layer. The thickness of the polymer film is not more than that of the metal foil, and heat is applied at the time of bonding/laminating the packaging board or at the time of hardening the adhesive layer.