发明名称 HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND RECORDING MEDIUM STORING COMPUTER PROGRAM CARRYING OUT THE SAME
摘要 An experiment is conducted in advance, for finding a temperature of a cooling plate attained as a result of balancing between a temperature of a substrate after heat treatment and a temperature of the cooling plate at the time of cooling of the substrate. Then, before heat treatment of a first substrate, the cooling plate is moved to a position above a hot plate, the cooling plate is heated to that temperature, and thereafter heat treatment of the substrate is started.
申请公布号 US2010236477(A1) 申请公布日期 2010.09.23
申请号 US20100788981 申请日期 2010.05.27
申请人 TOKYO ELECTRON LIMITED 发明人 ITO HIKARU;OKADA SHINJI;YAMASHITA MASAMI
分类号 B05C11/00;B05C21/00 主分类号 B05C11/00
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