| 摘要 |
An audio/video signal processor is provided and includes a first chip, a bus, and a second chip. The first chip comprises receives at least one input signal with display and sound information through at least one I/O interface and converts the input signal to generate a converted signal. The bus is communicated with the first chip. The second chip receives the converted signal through the bus and processes the converted signal to generate a display and sound signal for displaying and playing. The first chip and the second chip are packaged by the same packaging manner, such as quad flat package (QFP), with the second chip fabricated by a more advanced process than the first chip.
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