BOND FRAME INTEGRATED IN ELECTRONIC CIRCUIT

摘要

The invention relates to encapsulated integrated RF circuits comprising an integrated bond frame. Many integrated circuits need packaged for protection of the circuit or to connect the fine pitch of IC pins to the coarse pitch of a printed circuit board. It is known that passive components such as coils can be integrated into, e.g., lead-frame packages. Most MEMS (Micro Electro Mechanical Systems) require special packages, i.e., hermetic packages. Prominent examples are capacitive or galvanic MEMS switches for RF. A small and cost-effective package will lead to a wafer-scale package, where the MEMS wafer itself forms one part of the package. The other half can be another wafer that is bonded on the MEMS wafer, e.g., by eutectic bonding. The closed bond frame between the wafers forms an electrically coupled inductive element.