| 摘要 |
A polishing apparatus includes: a wafer polishing unit including a polishing surface plate, an abrasive supply part supplying an abrasive to a polishing pad placed on the polishing surface plate, and a wafer holding part holding a semiconductor wafer; and a dressing unit including a dresser. The dresser has a pellet-shaped grindstone with abrasive particles fixed to a surface thereof. The pellet-shaped grindstone is divided into a first region along an outer peripheral portion thereof and a second region located inside the first region. A chipping preventing portion for the abrasive particles is provided in the first region.
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