| 发明名称 |
ADHESIVE COMPOSITION AND ADHESIVE FILM USING THE SAME |
| 摘要 |
A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator.
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| 申请公布号 |
US2010240821(A1) |
申请公布日期 |
2010.09.23 |
| 申请号 |
US20080601066 |
申请日期 |
2008.05.20 |
| 申请人 |
NAKAMURA SHIGEHIRO;ITOU TOSHIHIKO;MANSEI YOUICHIROU |
发明人 |
NAKAMURA SHIGEHIRO;ITOU TOSHIHIKO;MANSEI YOUICHIROU |
| 分类号 |
C08L79/08 |
主分类号 |
C08L79/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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