LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

摘要

A method of fabricating a light emitting diode (LED) package structure is provided. A carrier and at least one LED chip having a light emitting surface and a plurality of side surfaces are provided. A first mask having at least one first opening is provided, and the first opening at least exposes the LED chip. A spray coating apparatus is provided above the first mask to perform a first spray coating process. The spray coating apparatus moves back and forth to spray a first phosphor solution over the LED chip so that the light-emitting surface and the side surfaces of the LED chip can be conformally covered by the sprayed first phosphor solution. The first phosphor solution is cured to form a first fluorescent layer by performing a curing process. A molding compound is formed to encapsulate the first fluorescent layer and a portion of the carrier.