| 摘要 |
A method for manufacturing a multilayer wiring substrate processes a via hole without unnecessarily increasing the diameter thereof and which can easily achieve the formation of fine wiring. A first resin layer in a cured state is prepared in which at least one first via hole including a bottom made of a conductive pattern is formed by laser processing, a second resin layer in an uncured state is prepared in which at least one second via hole is formed to penetrate therethrough at a position corresponding to the first via hole, and the first resin layer and the second resin layer are laminated to each other so that the first via hole and the second via hole communicate with each other. After a conductive paste is simultaneously filled in the first via hole and the second via hole, a metal foil is pressure-bonded to the second resin layer, and the second resin layer and the conductive paste are simultaneously cured. Subsequently, the metal foil is patterned.
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