发明名称 |
MASKING TAPE AND METHOD FOR PROCESSING WAFER SURFACE |
摘要 |
<p>Disclosed is a masking tape which has excellent adhesion at room temperature, while exhibiting high adhesion even in high-temperature water of 80-100°C. The masking tape can be easily removed after use. Specifically disclosed is a masking tape which is composed of a base and an adhesive layer formed on one surface of the base. The masking tape exhibits high adhesion even in high-temperature water of 80-100°C, and can be easily removed after use. The adhesive layer contains a copolymer which has a glass transition temperature of from -5°C to 15°C and contains at least a segment derived from an alkyl acrylate ester having an alkyl group with 5 or less carbon atoms, a segment derived from an acrylic monomer a homopolymer of which has a glass transition temperature of 80-120°C, and a segment having a radically polymerizable unsaturated bond in a side chain.</p> |
申请公布号 |
WO2010106938(A1) |
申请公布日期 |
2010.09.23 |
申请号 |
WO2010JP53780 |
申请日期 |
2010.03.08 |
申请人 |
SEKISUI CHEMICAL CO., LTD.;SUMII YUICHI;SUGITA DAIHEI;MURAYAMA HIROSHI |
发明人 |
SUMII YUICHI;SUGITA DAIHEI;MURAYAMA HIROSHI |
分类号 |
C09J7/02;C09J133/08;C23C18/31;C25D5/02;H01L21/288 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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