OPTIMIZING DESIGN METHOD FOR CHASSIS STRUCTURE OF ELECTRONIC EQUIPMENT BASED ON MECHANICAL, ELECTRIC AND THERMAL THREE-FIELD COUPLING

摘要

An optimizing design method for chassis structure of electronic equipment is disclosed, which includes: investigating from the point of view of mechanical, electric and thermal three-fields coupling, determining the initial design size of the chassis, mechanical analyzing by using the software Ansys; converting the grid model among the three-fields, obtaining the grid model used for the electromagnetic and thermal analysis; setting the thermal analysis parameter, thermal analyzing by using the software IcePak; determining the resonance frequency of the chassis and the electric parameter of the absorbing materials, electromagnetic analyzing by using the software FeKo; amending the analysis result by sample testing; judging whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, amending the initial CAD model, electromagnetic analysis parameter and thermal analysis parameter, repeating the above processes until the requirement is satisfied.