发明名称 |
Semiconductor device and method of manufacturing the same, and electronic apparatus |
摘要 |
A semiconductor device is provided as a back-illuminated solid-state imaging device. The device is manufactured by bonding a first semiconductor wafer with a pixel array in a half-finished product state and a second semiconductor wafer with a logic circuit in a half-finished product state together, making the first semiconductor wafer into a thin film, electrically connecting the pixel array and the logic circuit, making the pixel array and the logic circuit into a finished product state, and dividing the first semiconductor wafer and the second semiconductor being bonded together into microchips. |
申请公布号 |
EP2230691(A2) |
申请公布日期 |
2010.09.22 |
申请号 |
EP20100156350 |
申请日期 |
2010.03.12 |
申请人 |
SONY CORPORATION |
发明人 |
UMEBAYASHI, TAKU;TAKAHASHI, HIROSHI;SHOHJI, REIJIROH |
分类号 |
H01L27/146;H01L21/02;H01L27/00;H01L27/14;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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