发明名称 EPOXY RESIN COMPOSITION
摘要 An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R 1 is an aralkyl group, and R 2 is a lower alkyl group, provided that when R 2 is a methyl group, R 1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.
申请公布号 EP2161292(A4) 申请公布日期 2010.09.22
申请号 EP20080722318 申请日期 2008.03.18
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 SHINYA, YOSHIHISA;YAMAMOTO, JUN;AIZAKI, RYOTA;HAYASHI, NAOKI;KONISHI, MISAO
分类号 C08G59/68;C08L63/00;H01L21/52;H01L23/29 主分类号 C08G59/68
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