| 摘要 |
An object of this invention is to get a circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of semiconductor chip. This circuit board comprises, a insulating-ceramics substrate, a metal circuit plate bonded to one face of said insulating-ceramics substrate, a metal heat sink bonded to another face of said insulating-ceramics substrate, wherein (t 1 2 -t 2 2 ) /t c 2 /K<1.5, here, thickness of said insulating ceramics substrate is t c , thickness of said metal circuit plate is t 1 , thickness of said metal heat sink is t 2 , and internal fracture toughness value of said insulating ceramics substrate is K. |
