<p>A method of hole defect repair includes removing one or more defects (108) at or near a desired hole shape (102) in a substrate (100) by removing a non-concentric portion of the substrate (100) proximate the desired hole shape (102), and welding a filler material (124) to the substrate (100) after removing the non-concentric portion of the substrate (100).</p>
申请公布号
EP1775061(B1)
申请公布日期
2010.09.22
申请号
EP20060255252
申请日期
2006.10.12
申请人
UNITED TECHNOLOGIES CORPORATION
发明人
VARGAS, CHRIS;MULLOOLY, JOHN F.;BROWN, ALLEN WAYNE