| 摘要 |
<P>PROBLEM TO BE SOLVED: To fix a filmy LED to a substrate having good thermal conductivity so as to make it possible to dissipate heat from a rear of the substrate and to realize a very thin one with good heat dissipation. <P>SOLUTION: A backlight device comprises: a first substrate having thermal conductivity; an LED-laminated thin film that is formed of epitaxially grown inorganic material layers as a P-N junction device and fixed to a first surface of the first substrate; an anode electrode and a cathode electrode which are formed on the LED-laminated thin film; an anode driver IC and a cathode driver IC for driving the LED-laminated thin film to emit light; an anode wiring for connecting the anode driver IC and the anode electrode of the LED-laminated thin film, which is formed on a first surface of the first substrate, and a cathode wiring for connecting the cathode driver IC and the cathode electrode of the LED-laminated thin film; and a second substrate having optical transparency and having a function to evenly diffuse incident light. The second substrate is provided so as to face the first surface of the first substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
