发明名称 |
PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID |
摘要 |
<p>A plating method comprising: (a) applying a plating catalyst liquid containing a catalytic element and an organic solvent, to an object to be plated having, at least at a surface thereof, a functional group capable of forming an interaction with the catalytic element; and (b) performing plating on the object to be plated, to which the plating catalyst liquid has been applied.</p> |
申请公布号 |
EP2230328(A1) |
申请公布日期 |
2010.09.22 |
申请号 |
EP20080866921 |
申请日期 |
2008.12.19 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
NAGASAKI, HIDEO;SATO, MASATAKA |
分类号 |
H05K3/18;C23C18/16;C23C18/18;C23C18/20;C23C18/28;C23C18/31 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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