发明名称 PLATING METHOD, METHOD FOR FORMING METAL THIN FILM, AND PLATING CATALYST LIQUID
摘要 <p>A plating method comprising: (a) applying a plating catalyst liquid containing a catalytic element and an organic solvent, to an object to be plated having, at least at a surface thereof, a functional group capable of forming an interaction with the catalytic element; and (b) performing plating on the object to be plated, to which the plating catalyst liquid has been applied.</p>
申请公布号 EP2230328(A1) 申请公布日期 2010.09.22
申请号 EP20080866921 申请日期 2008.12.19
申请人 FUJIFILM CORPORATION 发明人 NAGASAKI, HIDEO;SATO, MASATAKA
分类号 H05K3/18;C23C18/16;C23C18/18;C23C18/20;C23C18/28;C23C18/31 主分类号 H05K3/18
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