发明名称 |
Method for the treating films |
摘要 |
A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure.
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申请公布号 |
US7799254(B2) |
申请公布日期 |
2010.09.21 |
申请号 |
US20030432337 |
申请日期 |
2003.10.27 |
申请人 |
AMCOR PACKAGING (AUSTRALIA) PTY |
发明人 |
HARVEY EROL CRAIG;WAYCOTT RAMON GLENNY;CAREW DAVID LEE |
分类号 |
B29C43/46;B26F1/24;B29C33/38;B29C59/02;B29C59/04;B29C67/20 |
主分类号 |
B29C43/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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