发明名称 Memory device and method of manufacturing the same
摘要 A example embodiment may provide a memory device that may include an active pattern on a semiconductor substrate, a first charge trapping layer pattern on the active pattern, a first gate electrode on the first charge trapping layer pattern, a second charge trapping layer pattern on a sidewall of the active pattern in a first direction, a second gate electrode on the second charge trapping layer pattern in the first direction, and/or a source/drain region in the active pattern. The memory device may have improved integration by forming a plurality of charge trapping layer patterns on the same active pattern.
申请公布号 US7799629(B2) 申请公布日期 2010.09.21
申请号 US20090385496 申请日期 2009.04.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM NA-YOUNG;OH CHANG-WOO;KIM SUNG-HWAN;CHOI YONG-LACK
分类号 H01L21/8238 主分类号 H01L21/8238
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