发明名称 |
Integrated module for data processing system |
摘要 |
An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias.
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申请公布号 |
US7799613(B2) |
申请公布日期 |
2010.09.21 |
申请号 |
US20090543144 |
申请日期 |
2009.08.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANG BING;KNICKERBOCKER JOHN U.;TSANG CORNELIA K. |
分类号 |
H01L21/98 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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