发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE |
摘要 |
The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000. |
申请公布号 |
KR20100102238(A) |
申请公布日期 |
2010.09.20 |
申请号 |
KR20107019373 |
申请日期 |
2006.03.15 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
KATOGI SHIGEKI;IZAWA HIROYUKI;SUTOU HOUKO;YUSA MASAMI;FUJINAWA TOHRU |
分类号 |
C09J175/16;C09J9/02;H01B1/20;H01L21/60 |
主分类号 |
C09J175/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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