发明名称 ROTATING MAGNET SPUTTERING APPARATUS
摘要 Provided is a rotary magnet sputtering apparatus which includes a plasma shielding member and an outer wall connected to the ground and which has a series resonant circuit and a parallel resonant circuit between the plasma shielding member and the outer wall. The series resonant circuit has a very low impedance only at its resonant frequency while the parallel resonant circuit has a very high impedance only at its resonant frequency. With this configuration, the impedance between substrate RF power and the plasma shielding member becomes very high so that it is possible to suppress the generation of plasma between a substrate 10 to be processed and the plasma shielding member. Further, since a series resonant circuit is provided between a target and the ground, the RF power is efficiently supplied only to a region where the substrate passes under the target, so that a self-bias voltage is generated.
申请公布号 KR20100102239(A) 申请公布日期 2010.09.20
申请号 KR20107019392 申请日期 2009.03.02
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY;TOKYO ELECTRON LIMITED 发明人 OHMI TADAHIRO;GOTO TETSUYA;MATSUOKA TAKAAKI
分类号 C23C14/34;H01L21/31 主分类号 C23C14/34
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