摘要 |
PURPOSE: A light emitting device is provided to dissipate the heat of a light emitting device through the working fluid of a heat dissipation module and a condensing part. CONSTITUTION: A light emitting device is loaded on a substrate. The light emitting device comprises a heat dissipation module which dissipate heat which is conducted from the light emitting device(110). The heat dissipation module comprises a heat pipe or a thermosiphon. A heat dissipation protrusion is contacted with the working fluid of the heat dissipation module(150) through the projection hole and is projected under a first lead frame. |