| 摘要 |
PURPOSE: An LED panel with a heat sink is provided to improve heat dissipation efficiency by filling an embossing and a combining groove with a thermal material. CONSTITUTION: A plurality of LED packages are attached to the upper side of a PCB substrate(61). A lower surface of the PCB substrate is combined with a cooling fin(62). A plurality of combining grooves(61a) are formed in the lower surface of the PCB substrate. Embossings(62a) corresponding to the combining groove are formed on the upper side of a radiation fin. The combining grooves correspond to LED package on the upper side of the PCB substrate.
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