METHOD FOR MANUFACTURING A QFN SEMICONDUCTOR PACKAGE HAVING PLURALITY ROW OF LEADS

摘要

PURPOSE: A method for manufacturing a quad flat no-leads(QFN) semiconductor package is provided to form multiple columns of pins on a lead frame using a common frame. CONSTITUTION: A common frame for manufacturing a QFN semiconductor package is prepared(S100). A stud bump is formed by implementing a stud bonding process on the upper side of the common frame(S120). A semiconductor chip is loaded on the upper side of the common frame using an adhesive(S130). The bond pad of the semiconductor chip is connected with the stud bump using a wire(S140).