APPARATUS FOR BONDING SEMICONDUCTOR CHIP AND METHOD FOR DOING THE SAME

摘要

PURPOSE: A semiconductor chip bonding device and a bonding method thereof are provided to bond a semiconductor by applying a distribution load to a semiconductor chip. CONSTITUTION: A first jig(110) includes a first surface where a semiconductor chip(S) is attached. A second jig(120) is movably arranged so that a second surface is adjacent to the first surface. A semiconductor chip bonding device(100) includes an elastic film(130) which is elastically transformed in order to apply a distribution load to the semiconductor assembly.