发明名称 MULTI STEP CHIP MOUNTING SEQUENCE AUTOMATIC DECISION METHOD
摘要 PURPOSE: A method is provided to minimize the time loss and the physical loss of a worker by determining the mounting order of parts based on the height and the thickness of parts. CONSTITUTION: A mounting map includes a plurality of cells(S10). Cell information corresponding to each part is saved(S20). Parts is determined whether the parts are overlapped with each other(S30). It is determined whether the mounting height of parts is same(S50). When the mounting height of the parts is different, the mounting order is determined according to the mounting height of parts(S60). When the mounting height of the parts is same, it is determined whether the thickness of the parts is the same with each other(S70). When the thickness of the parts is dissimilar, the mounting order of the parts is determined according to the thickness of the parts(S80).
申请公布号 KR20100101430(A) 申请公布日期 2010.09.17
申请号 KR20090019918 申请日期 2009.03.09
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 LEE, JE PIL
分类号 H05K13/04;H05K3/30;H05K13/02 主分类号 H05K13/04
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