| 摘要 |
PURPOSE: A semiconductor device is provided to improve the performance of a device by reducing power noise. CONSTITUTION: A semiconductor device includes a chip(1) and a package(2). The package packages the chip by including a plurality of sixth power terminals which are connected through a plurality of second power terminals and a second wire. The chip includes a plurality of first power terminals which are commonly connected to a first power line, a plurality of second power terminals which are connected to a second power line, at least one connection terminal, at least one third power terminal which is connected to the first power line, at least one fourth power terminal which is connected to a second power line, and an on-die capacitor.
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