发明名称 METHOD OF CHEMICAL MECHANICAL POLISHING PHASE-CHANGE MATERIALS AND METHOD OF FABRICATING PHASE-CHANGE RANDOM ACCESS MEMORY USING THE SAME METHOD
摘要 PURPOSE: A method for chemically and mechanically polishing a phase change material and a method for manufacturing a phase change memory device are provided to reduce the change of composition of the phase change materials. CONSTITUTION: A phase change material(11) is formed on an active surface of a semiconductor wafer. The phase change material is chemically and mechanically polished by a slurry and a polishing pad. The change of composition of the phase change material is suppressed by controlling the temperature of a contact area between the phase change material and the polishing pad within a preset range.
申请公布号 KR20100101379(A) 申请公布日期 2010.09.17
申请号 KR20090019846 申请日期 2009.03.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JOON SANG;MIN, CHUNG KI;KIM, DONG KEUN;JON, YEOL;HWANG, CHANG SUN;KIM, TAE EUN
分类号 H01L21/304;H01L21/8247 主分类号 H01L21/304
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