发明名称 APPARATUS AND METHOD OF LASER BEAM MACHINING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus and method of laser beam machining, which performs accurate scribing with a simple mechanism, even on a substrate of a brittle material such as glass having a thin film sheet of synthetic resin or the like. <P>SOLUTION: The apparatus of laser beam machining includes: a laser irradiation mechanism comprising a laser oscillator for oscillating a pulsed laser beam and a condensing optical mechanism for converging and emitting the pulsed laser beam so oscillated; and a moving mechanism for moving the laser irradiation mechanism along a planned line on the surface of a substrate of a brittle material substrate. A scribing groove is formed along the planned line on the surface of the brittle material substrate. On one side of the brittle material substrate, a synthetic resin layer is formed, with the pulsed laser beam emitted from the side on which the synthetic resin layer is formed. After the radiation of the pulsed laser beam by making an adjustment so that the focal position is a first focal position away from the surface with the synthetic resin layer formed, the radiation is resumed for the specific duration by making a readjustment so that the focal position is a second focal position closer to the surface with the synthetic resin layer formed compared with the first position. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010201479(A) 申请公布日期 2010.09.16
申请号 JP20090051528 申请日期 2009.03.05
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SHIMIZU SEIJI;MURAKAMI MASANAO;HATA TSUYOSHI;FUKUHARA KENJI
分类号 B23K26/00;B23K26/04;B23K26/06;B28D5/00;C03B33/09;H01L21/301 主分类号 B23K26/00
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