发明名称 LEADFRAME PACKAGE FOR LIGHT EMITTING DIODE DEVICE
摘要 An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
申请公布号 US2010230791(A1) 申请公布日期 2010.09.16
申请号 US20100768755 申请日期 2010.04.28
申请人 NEPES LED CORPORATION 发明人 TRAN NGUYEN THE;HE YONGZHI;SHI FRANK
分类号 H01L23/495 主分类号 H01L23/495
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