| 摘要 |
One embodiment of the present invention uses transmission lines structure to excite micro-plasma. The excited micro-plasma will induce a gas flow to cool down heat sink assembly. The micro-plasma may be excited with a DC source, a RF source, or a microwave source. In one embodiment, the transmission lines structure may comprise a microstrip conductor, a stripline conductor, a conductor trace, a paired differential traces, a dielectric layer, a ground layer, a dielectric resonator, and a cavity. The transmission lines structure may have patterns to induce high electric field at local regions. The micro-plasma may be used to create local turbulence near solid surface to enhance the heat transfer efficiency.
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