| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high power light-emitting diode package excellent in light efficiency and heat dissipation characteristic. <P>SOLUTION: The high power light-emitting diode package 1 includes a base member 10, reflection portions 20 provided on the base member, a plurality of LED chips 30 surrounded by at least a first reflection portion out of the reflection portions and mounted on the base member, and a connecting means provided on the base member so as to be electrically connected and externally connected to the LED chips, wherein the reflection portions include a second reflection portion surrounding the first reflection portion. <P>COPYRIGHT: (C)2010,JPO&INPIT |
