发明名称 ELECTRODE CONNECTION METHOD AND ELECTRONIC CIRCUIT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electrode connection method and an electronic circuit having versatility. <P>SOLUTION: A first conductive material layer 12a is formed on a first electrode terminal 11a formed on a junction object 11, a second conductive material layer 12b having a material different from the first conductive material layer is formed by being pasted on the first conductive material layer 12a, and a bump 12 is formed of the first and second conductive material layers 12a, 12b. The junction object 11 on which the bump 12 is formed is arranged so as to face an object to be joined 19 having a second electrode terminal 19a at a place corresponding to the first electrode terminal 11a, and the junction object 11 is electrically connected to the object 19 to be joined by softening the second conductive material layer 12b without being melted by reflowing at a predetermined temperature and by pressing the bump 12 which is composed of the first and second conductive material layers 12a, 12b to the second electrode terminal 19a. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010205996(A) 申请公布日期 2010.09.16
申请号 JP20090050798 申请日期 2009.03.04
申请人 SONY CORP 发明人 KONTO TAKAYUKI;MOTOYOSHI HITOSHI;SATO JUNICHI
分类号 H01L21/60 主分类号 H01L21/60
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