| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device of inspecting a semiconductor substrate capable of inspecting the acceptance/rejection of a wiring on a semiconductor substrate with a high precision. SOLUTION: An electron beam 13 is radiated to the semiconductor substrate 14 to detect secondary electrons 16. A signal processing device 18 prepares a potential contrast image indicating the state of a surface to be inspected of the semiconductor substrate 14 in accordance with the signal intensity of the secondary electrons 16. A control computer 19 replaces the image of the wiring, which is not the object to be inspected and can be a noise source in the defect inspection, with the self-generated image, and inspects the defect of the wiring to be inspected based on the contrast image after the replacing process. COPYRIGHT: (C)2010,JPO&INPIT |
