| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of producing electrical contact excellent in depositability and adhesiveness of a noble metal plating film according to electroless plating formed on a Ni-P electroless plating film particularly having a large P-content. Ž<P>SOLUTION: The Ni-P electroless plating film is formed according to an electroless plating method, subsequently, a cathode and an anode are disposed in a plating bath, a current is caused to flow and, thereby, a bipolar plating film which is made of Ni-P and has a Ni-content larger than that of the Ni-P electroless plating film is formed on the surface directing the anode side of the Ni-P electroless plating film by utilizing a bipolar phenomenon. Because the bipolar plating film has a large Ni content, the surface activity when a noble metal plating film is subjected to electroless plating is high and, as the result, the electrical contact excellent in depositability and adhesiveness of the noble metal plating film can be produced. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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