发明名称 METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER
摘要 As for electrode pads for a semiconductor integrated circuit element, some of electrode pads for signal transmission are coupled to Ti films. Others of the electrode pads for signal transmission are coupled to electrode pads through wiring routed in multilayer wiring. Electrode pads for power supply are coupled to electrode pads to which power lines at potentials different from each other are coupled through wiring. The electrode pads are also coupled to Al foils (anodes). Electrode pads for grounding are coupled to electrode pads to which ground lines are coupled through wiring. The electrode pads are also coupled to conductive polymer films (cathodes).
申请公布号 US2010233359(A1) 申请公布日期 2010.09.16
申请号 US20100782867 申请日期 2010.05.19
申请人 FUJITSU LIMITED 发明人 SHIOGA TAKESHI;MIZUKOSHI MASATAKA;KURIHARA KAZUAKI
分类号 H01G4/00 主分类号 H01G4/00
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