发明名称 |
ELECTROLESS PALLADIUM PLATING SOLUTION AND METHOD OF USE |
摘要 |
Abstract An electroless palladium plating solution includes a polar solvent, at least one palladium salt, at least one non-nitrogenated complexing agent, an alkaline adjusting agent that adjusts the plating solution to a pH of at least 8.0, and a reducing agent. The plating solution, which is used for forming a layer of palladium on a surface of a substrate, yields a substantially pure palladium deposit on the substrate. Precipitation of reduced palladium in the plating solution is substantially prevented. |
申请公布号 |
WO2010065851(A3) |
申请公布日期 |
2010.09.16 |
申请号 |
WO2009US66767 |
申请日期 |
2009.12.04 |
申请人 |
OMG AMERICAS, INC.;PIANO, ANTHONY M.;TRAINOR, JAMES |
发明人 |
PIANO, ANTHONY M.;TRAINOR, JAMES |
分类号 |
C23C18/52;C23C18/31;C23C18/54 |
主分类号 |
C23C18/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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