| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element capable of bringing an FFP into a favorable Gaussian shape of reduced ripple, and to provide a semiconductor light emitting element capable of enhancing a close tightness between a resonator end face and a protection film, capable of increasing manufacturing efficiency, and capable of reducing a manufacturing cost. <P>SOLUTION: This semiconductor light emitting element includes a substrate, a semiconductor layer laminated on the substrate, and a protrusion formed on an end face in a resonator side of the semiconductor layer, the protrusion has a light emitting face and a side face, a top view shape of the protrusion has a continuous wave-like shape or irregular shape, and the side face of the protrusion has an area of surface roughness larger than that of the light emitting face. <P>COPYRIGHT: (C)2010,JPO&INPIT |
